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: PRODUCTS : Glass Substrate Chipping Inspection System
Glass substrate edge inspection equipment
In-line integration into the wafer production line is possible
Substrate type
Transparent glass
Substrate size
Max. 700 mm x 920 mm
Defect size
0.1 mm or larger
(50 µm to 100 µm is a gray area. Detection is possible depending upon the type of defect.)
Inspection time
Approx. 20 sec/substrate
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