Because drying is accomplished at room temperature and room pressure, this method differs from conventional thermal drying, and is effective for films, 3D products, textiles, and products with low heat resistance. Excellent effects are also demonstrated on products after the wet cleaning process for conventional TFT, CF, mask, cassette, and printed circuit boards, etc.
- Not only appropriate in new configurations, it is also easily integrated with existing equipment.
- Achieves low cost, small footprint, high throughput and high performance.
| Size |
No limit |
| Processing N2 dew point temperature |
-80°C |
| Processing N2 purity |
99.9% |
| Processing time |
Transport speed: approx. 1 to 5 m/min |
| Dry air |
Capacity and pressure depend on size |
| Power |
200 V |
| Exhaust |
Capacity depends on size |
- Space-saving (thermal drying) Approx. 31% reduction (FEBACS comparison)
- Power consumption (thermal drying) Approx. 40% reduction (FEBACS comparison)
- Drying at room temperature Heat shock reduction
