FEBACS offers the “Brain Coater” made by EMTEC Co., Ltd. as the most optimum device for resist-coating in the FPD front-end and CF manufacturing processes.
In comparison with conventional S&S (Slit and Spin) coating, the Brain Coater has decreased the usage of resist by as much as 1/3 as well as reducing the particle dispersion that is caused by air currents during spin coating. This removes the necessity for an edge cleaning unit and thus contributes to lowering the equipment's overall footprint as well.
The Brain Coater also displays overwhelmingly superior performance in color resist and PS and OC polyimide material coating as well as other processes normally seen as being difficult to accomplish with linear coating methods.
Equipped with a high-precision base and nozzle, the Brain Coater performs resist-coating using a scanning operation that keeps the high-precision nozzle out of contact with the glass substrates set on the base. Film thickness is controlled linearly via both the volume of resist ejected from the nozzle and the speed of coating.
- Fast processing tact time (under 30 seconds with G3 substrates)
- 40% smaller footprint
- Amount of resist and rinse reduced by 1/3 from conventional methods
- Improved yield, reduced contamination
- 20% reduction in utility costs (power, exhaust)
| Applications |
LCD arrays, color filter, organic ELD, LTPS, etc. |
| Substrate dimensions |
Up to 680 mm x 880 mm |
| Substrate thickness |
0.4 mm to 1.1 mm
(each substrate thickness measured) |
| Coating area |
To within 1 mm from edge of the substrate |
| Coated film thickness |
1 μ to 5 μ |
| Coating precision |
±1% to 3% |
| Resist viscosity |
3 cP to 30 cP |
| Processing performance |
30 sec. to 45 sec. |
